EduPar Posters

Deepak Aggarwal, Fei Cao, Harish Charan, Debzani Deb, Dabin Ding, Toby Dragon, Muztaba Fuad, Prashant Kumar, Hemant Joshi, Anthony Moore, Justin Shi, Michelle Zhu, Martina Barnas, Noemi Rodriguez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper provides an overview of the five posters accepted for the EduPar'19 poster session. The poster session has proved to be an important opportunity for interaction among the community, fostering the discussion of innovative approaches and ideas that are under development.

Original languageEnglish
Title of host publicationProceedings - 2019 IEEE 33rd International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages347-349
Number of pages3
ISBN (Electronic)9781728135106
DOIs
StatePublished - 1 May 2019
Event33rd IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019 - Rio de Janeiro, Brazil
Duration: 20 May 201924 May 2019

Publication series

NameProceedings - 2019 IEEE 33rd International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019

Conference

Conference33rd IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019
CountryBrazil
CityRio de Janeiro
Period20/05/1924/05/19

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Keywords

  • Concurrency and parallelism concepts
  • Curriculum integration
  • Parallel computing education
  • Parallel computing topics

Cite this

Aggarwal, D., Cao, F., Charan, H., Deb, D., Ding, D., Dragon, T., Fuad, M., Kumar, P., Joshi, H., Moore, A., Shi, J., Zhu, M., Barnas, M., & Rodriguez, N. (2019). EduPar Posters. In Proceedings - 2019 IEEE 33rd International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019 (pp. 347-349). [8778245] (Proceedings - 2019 IEEE 33rd International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPDPSW.2019.00065